The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Dec. 30, 2022
Applicant:
Nxp B.v., Eindhoven, NL;
Inventors:
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/103 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01P 3/12 (2006.01); H01P 5/107 (2006.01); H01Q 1/50 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01P 5/103 (2013.01); H01L 21/4853 (2013.01); H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01P 3/121 (2013.01); H01P 5/107 (2013.01); H01Q 1/50 (2013.01); H05K 1/0243 (2013.01); H01L 24/16 (2013.01); H01L 2223/6633 (2013.01); H01L 2224/16227 (2013.01); H05K 1/181 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09985 (2020.08); H05K 2201/10378 (2013.01);
Abstract
A compact integrated circuit (IC) that outputs millimeter-wave energy can be assembled into a highly compact package that can utilize ultrasmall contacts and/or contacts arrange with nonstandard pitch. The millimeter-wave IC can be assembled onto an interposer that includes an integrated transition configured to be coupled to a millimeter-wave waveguide on a printed circuit board having contacts that have a standardized size and pitch.