The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Jun. 22, 2022
International Business Machines Corporation, Armonk, NY (US);
Anil Yuksel, Austin, TX (US);
Jose A. Hejase, Pflugerville, TX (US);
Junyan Tang, Austin, TX (US);
Pavel Roy Paladhi, Pflugerville, TX (US);
Joshua Myers, Austin, TX (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multi-chip package structure is provided. The multi-chip package structure includes a first IC chip and a second IC chip, and a fluid conduit thermally coupled to the first IC chip and the second IC chip. The multi-chip package structure is configured to remove heat generated by at least one of the first IC chip and the second IC chip. The fluid conduit has a first end and a second end opposite to the first end. The multi-chip package structure also includes a first monopole feed connected between the first IC chip and the first end of the fluid conduit, and a second monopole feed connected between the second IC chip and the second end of the fluid conduit. The first monopole feed is configured to transmit an electromagnetic signal through the fluid conduit toward the second monopole feed and vice versa.