The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Jan. 02, 2024
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventor:

Yusuke Fujii, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 21/56 (2006.01); H01L 23/552 (2006.01); H05K 1/02 (2006.01); H05K 3/22 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/56 (2013.01); H05K 1/0218 (2013.01); H05K 1/185 (2013.01); H05K 3/22 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01); H05K 2203/1366 (2013.01); H05K 2203/1469 (2013.01);
Abstract

Provided are an electronic device including: a wiring board having a mounting surface; a plurality of electronic components mounted on the mounting surface; a ground electrode that surrounds at least one electronic component among the plurality of electronic components; an insulating protective layer that covers the at least one electronic component; an electromagnetic wave shielding layer that covers the insulating protective layer and is electrically connected to the ground electrode, the electromagnetic wave shielding layer being a solidified product of an ink for forming an electromagnetic wave shielding layer; and an insulating partition wall that is provided along an outer edge of the ground electrode, and a manufacturing method thereof.


Find Patent Forward Citations

Loading…