The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Jun. 10, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Gyeongseok Song, Hwaseong-si, KR;

Kyeongjoon Ko, Yongin-si, KR;

Jaehyun Park, Seoul, KR;

Junhan Bae, Hwaseong-si, KR;

Jongjae Ryu, Changwon-si, KR;

Nakwon Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H10D 84/01 (2025.01); H10D 84/83 (2025.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H10D 84/0149 (2025.01); H10D 84/83 (2025.01);
Abstract

An integrated circuit is provided. The integrated circuit includes: an active region extending in a first direction; gate electrodes extending in a second direction in parallel with each other; source/drain regions provided on the active region between the gate electrodes; a first gate contact connected to the gate electrodes and extending in the first direction; a first gate wiring pattern provided in a first wiring layer, electrically connected to the gate electrodes through the first gate contact, and overlapping the first gate contact along a third direction perpendicular to the first and second directions; and source/drain wiring patterns provided in a second wiring layer, electrically connected to the source/drain regions, respectively, extending in parallel with the second direction, and overlapping the source/drain regions along the third direction, the second wiring layer being provided on the first wiring layer.


Find Patent Forward Citations

Loading…