The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
May. 10, 2019
Applicant:
Resonac Corporation, Tokyo, JP;
Inventors:
Tsuyoshi Tazawa, Tokyo, JP;
Naohiro Kimura, Tokyo, JP;
Keisuke Ohkubo, Tokyo, JP;
Yoshinobu Ozaki, Tokyo, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 22/10 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01);
Abstract
A method for evaluating pickup property of a dicing/die-bonding integrated film including a base layer, an adhesive, and a bonding adhesive layer in order, the method including preparing a laminate including the dicing/die-bonding integrated film and a wafer having a thickness of 10 to 100 μm laminated on the bonding adhesive layer, singulating the wafer into a plurality of chips having an area of 9 mmor less, pushing a center portion of the chip from a side of the base layer, and measuring a peeling strength when an edge of the chip is peeled off from the adhesive layer.