The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Aug. 30, 2019
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Xinyu Bao, Fremont, CA (US);

Haoquan Fang, Sunnyvale, CA (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32449 (2013.01); C23C 16/45544 (2013.01); C23C 16/45565 (2013.01); H01J 37/32724 (2013.01); H01L 21/0228 (2013.01); H01L 21/02326 (2013.01); H01L 21/0234 (2013.01); H01L 21/3065 (2013.01); H01J 2237/334 (2013.01);
Abstract

A method for treating an exposed surface of a substrate includes purging first and second chambers of a substrate processing system using a purge gas. A gas distribution device is arranged between the first chamber and the second chamber. The method includes flowing a treatment gas to the second chamber but not the first chamber to create an adsorption layer on a surface of a substrate arranged on a substrate support in the second chamber. The method includes stopping flow of the treatment gas to the second chamber. The method includes flowing the purge gas to purge the first chamber and the second chamber. The method includes, while flowing the purge gas to the first chamber, striking plasma in the first chamber to create metastable active radical species and delivering the metastable active radical species through the gas distribution device to the second chamber to surface activate the adsorption layer.


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