The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Aug. 16, 2023
Asia Vital Components (Shen Zhen) Co., Ltd., Shenzhen, CN;
ASIA VITAL COMPONENTS (SHEN ZHEN) CO., LTD., Shenzhen, CN;
Abstract
A heat dissipation structure includes a base provided on top and bottom surfaces with a solder dispensing opening and a plurality of receiving grooves, respectively; and a plurality of heat pipes. The solder dispensing opening is transversely extended across and communicable with a top of the receiving grooves. The heat pipes are fitted in the receiving grooves and subjected to a mechanical processing to be flush with the bottom surface of the base. A type of solder is filled into a space between the heat pipes and the receiving grooves via the solder dispensing opening. Then, the heat pipes and the base are heated in a heating furnace. After removing the heat pipes and the base from the furnace, the solder is cooled and cured to form a solder layer, which fills up the space and tightly connect the heat pipes to the base to avoid thermal resistance between them.