The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Sep. 13, 2022
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Shigeru Kinoshita, Yokkaichi Mie, JP;

Hiroshi Toyoda, Yokkaichi Mie, JP;

Satoshi Wakatsuki, Yokkaichi Mie, JP;

Masayuki Kitamura, Yokkaichi Mie, JP;

Naomi Fukumaki, Yokkaichi Mie, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/44 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45529 (2013.01); C23C 16/34 (2013.01); C23C 16/403 (2013.01); C23C 16/4408 (2013.01); C23C 16/4412 (2013.01); C23C 16/45544 (2013.01);
Abstract

According to one embodiment, a film forming method includes alternately performing a first process including at least two times of a first sequence and a second process including at least one time of a second sequence. The first sequence includes supplying a film forming gas into a film forming chamber, supplying a first purge gas into the film forming chamber, supplying a first reduction gas into the film forming chamber, and supplying a second purge gas into the film forming chamber, in order, and the second sequence includes supplying a second reduction gas into the film forming chamber, and supplying a third purge gas into the film forming chamber, in order.


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