The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Oct. 07, 2022
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Uwe Franken, Dormagen, DE;
Hans-Georg Kinzelmann, Pulheim, DE;
Andreas Ferencz, Duesseldorf, DE;
Stefanie Stapf, Essen, DE;
Assignee:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/40 (2018.01); C09J 5/06 (2006.01); C09J 11/04 (2006.01); C09J 201/00 (2006.01);
U.S. Cl.
CPC ...
C09J 7/401 (2018.01); C09J 5/06 (2013.01); C09J 11/04 (2013.01); C09J 201/00 (2013.01); C09J 2203/37 (2020.08); C09J 2301/314 (2020.08); C09J 2301/408 (2020.08); C09J 2301/502 (2020.08);
Abstract
The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive system comprising an adhesive layer having conductive particles.