The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Jun. 07, 2022
Applicant:

Aac Kaitai Technologies (Wuhan) Co., Ltd, China, CN;

Inventors:

Kaijie Wang, Shenzhen, CN;

Bei Tong, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B81B 3/0094 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/04 (2013.01);
Abstract

A MEMS microphone includes a substrate having a back cavity, a vibration diaphragm system, and a housing. The vibration diaphragm system includes at least two sub-vibration diaphragm assemblies, a slit is formed between adjacent two of the at least two sub-vibration diaphragm assemblies, one end, distal from the housing, of each of the at least two sub-vibration diaphragm assemblies is fixed to a cross beam assembly, and first gaps are formed between the at least two sub-vibration diaphragm assemblies and inner sides of the housing, so that the at least two sub-vibration diaphragm assemblies form a cantilever beam structure, which increases compliance of the vibration diaphragm system and further improves sensitivity of microphones.


Find Patent Forward Citations

Loading…