The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Sep. 11, 2024
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Atsushi Hayakawa, Tokyo, JP;

Yoshinori Satou, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B67C 3/22 (2006.01); B29C 49/42 (2006.01); B29C 49/48 (2006.01); B29C 49/78 (2006.01); B67C 3/26 (2006.01); B67C 7/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B67C 7/0073 (2013.01); B29C 49/4238 (2022.05); B29C 49/42808 (2022.05); B29C 49/42822 (2022.05); B29C 49/4823 (2013.01); B29C 49/786 (2013.01); B67C 3/2642 (2013.01); B29C 2049/4825 (2013.01); B29C 2049/4889 (2013.01); B29C 2049/78645 (2022.05); B29C 2049/78675 (2022.05); B29L 2031/7158 (2013.01); B67C 2003/227 (2013.01); B67C 2003/228 (2013.01); B67C 2007/006 (2013.01); B67C 2007/0066 (2013.01);
Abstract

A preform is heated, the heated preform is sealed in a sealing apparatus including a neck portion mold, a trunk portion mold and a bottom portion mold at a predetermined temperature range, and the heated preform sealed in the molds is blow-molded into a bottle. Any molded bottle is removed if the mold surface temperature of the neck portion mold, the trunk portion mold and the bottom portion mold are outside of the predetermined temperature range. A sterilizer is blasted to any molded bottle not removed when the mold surface temperature of all of the molds is in the predetermined temperature range.


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