The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Jan. 22, 2021
Applicant:
Nikon Corporation, Tokyo, JP;
Inventors:
Yoshihiro Maehara, Tokyo, JP;
Atsushi Kamashita, Tokyo, JP;
Hajime Mitsuishi, Tokyo, JP;
Minoru Fukuda, Tokyo, JP;
Assignee:
Nikon Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01); B32B 37/10 (2006.01); H01L 21/18 (2006.01); H01L 21/20 (2006.01); H01L 21/66 (2006.01); B23K 20/00 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H10D 84/00 (2025.01); H10D 84/03 (2025.01); H10D 99/00 (2025.01); H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
B32B 37/12 (2013.01); B32B 37/10 (2013.01); H01L 21/185 (2013.01); H01L 21/2007 (2013.01); H01L 21/2011 (2013.01); H01L 21/2015 (2013.01); H01L 22/12 (2013.01); B23K 20/00 (2013.01); B32B 2457/08 (2013.01); H01L 21/02 (2013.01); H01L 21/67092 (2013.01); H10D 84/00 (2025.01); H10D 84/038 (2025.01); H10D 99/00 (2025.01); H10F 39/011 (2025.01); H10F 39/803 (2025.01);
Abstract
A bonding method including firstly bonding a first substrate to a second substrate by releasing a holding of the first substrate to form a first stack; and secondly bonding one substrate, which has been thinned, among the first substrate and the second substrate that have been bonded, to a third substrate, to form a second stack, wherein when the first substrate is thinned, the holding of the third substrate is released at the second bonding, and when the second substrate is thinned, the holding of the first stack is released at the second bonding.