The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Mar. 31, 2022
Taiyo Holdings Co., Ltd., Hiki-gun, JP;
Shoko Mishima, Hiki-gun, JP;
Shoya Sekiguchi, Hiki-gun, JP;
Kota Oki, Hiki-gun, JP;
Nobuhiro Ishikawa, Hiki-gun, JP;
TAIYO HOLDINGS CO., LTD., Hiki-gun, JP;
Abstract
Provided is a curable resin laminate capable of easily producing an insulating layer having low dielectric properties and excellent adhesion (peel strength) to a conductor layer. A curable resin laminate includes: a first resin layer including a first curable composition, and a second resin layer including a second curable composition and laminated on the first resin layer. The second resin layer has a thickness of 5 to 35% relative to a total thickness of the first resin layer and the second resin layer, the first curable composition contains (A1) a polyphenylene ether and a filler, and a content rate (M) of the filler is 30% by mass or more relative to a total solid content. The second curable composition contains (A2) a polyphenylene ether, and a content rate (M) of a filler is 40% by mass or less relative to a solid content, M>M, and (A1) and (A2) have a slope that is less than 0.6, calculated by a conformation plot.