The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Mar. 04, 2020
Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Nobuhiko Matsumoto, Hiratsuka, JP;

Jin Nakamura, Hiratsuka, JP;

Yuuki Sato, Hiratsuka, JP;

Atsushi Sakai, Hiratsuka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/04 (2019.01); B32B 3/30 (2006.01); B32B 15/088 (2006.01); B32B 15/09 (2006.01);
U.S. Cl.
CPC ...
B32B 7/04 (2013.01); B32B 3/30 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 2250/02 (2013.01); B32B 2262/106 (2013.01); B32B 2307/732 (2013.01);
Abstract

To provide a multilayered body with high adhesion between a resin layer containing a nanofiber or the like and a metal layer, and a method for manufacturing a multilayered body. The multilayered body contains: a metal layer having an uneven region with an average length (RSm) of a contour curve element from 0.5 to 10 μm; and a resin layer in contact with the uneven region of the metal layer, the resin layer containing a thermoplastic resin and a fibrous filler, the fibrous filler having a number average fiber diameter (F) of less than 1 μm, and a ratio (RSm/F) of the average length (RSm) of the contour curve element of the uneven region to the number average fiber diameter (F) from 1 to 20000.


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