The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Jul. 11, 2023
Seiko Epson Corporation, Tokyo, JP;
Keitaro Hashizume, Shiojiri, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A three-dimensional shaping method of shaping a three-dimensional shaped article using a first material including first resin and a second material including second resin having a heat shrinkage rate different from a heat shrinkage rate which the first resin has, the method including stacking, when preparing a first slice layer formed of one of the first material and the second material, and stacking a second slice layer formed of another of the first material and the second material on the first slice layer, a first boundary layer formed of the one of the first material and the second material on the first slice layer, staking a second boundary layer formed of the another of the first material and the second material on the first boundary layer, and stacking the second slice layer on the second boundary layer, wherein the first boundary layer is a layer provided with a plurality of voids formed inside a contour of the first boundary layer when viewing the first boundary layer from a stacking direction of the first slice layer and the second slice layer.