The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2025

Filed:

Nov. 04, 2019
Applicant:

Ecole Polytechnique Federale DE Lausanne (Epfl), Lausanne, CH;

Inventors:

Nikola Kalentics, Lausanne, CH;

Roland Logé, Lausanne, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/28 (2021.01); B22F 10/00 (2021.01); B22F 10/32 (2021.01); B22F 10/50 (2021.01); B22F 10/73 (2021.01); B22F 12/00 (2021.01); B22F 12/41 (2021.01); B22F 12/70 (2021.01); B23K 26/16 (2006.01); B23K 26/342 (2014.01); B23K 26/356 (2014.01); B23K 26/70 (2014.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/20 (2020.01); C21D 10/00 (2006.01); B22F 10/60 (2021.01);
U.S. Cl.
CPC ...
B23K 26/342 (2015.10); B22F 10/00 (2021.01); B22F 10/28 (2021.01); B22F 10/32 (2021.01); B22F 10/50 (2021.01); B22F 10/73 (2021.01); B22F 12/22 (2021.01); B22F 12/41 (2021.01); B22F 12/70 (2021.01); B23K 26/16 (2013.01); B23K 26/356 (2015.10); B23K 26/706 (2015.10); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/20 (2020.01); C21D 10/005 (2013.01); B22F 10/60 (2021.01); B22F 2201/02 (2013.01); B22F 2201/11 (2013.01);
Abstract

A laser treatment system and method for imparting beneficial residual stresses into a desired part during production thereof by a Selective Laser Sintering or Melting (SLS/SLM) process, the method including repeatedly subjecting the part to an in-situ Laser Shock Peening (LSP) treatment during the SLS/SLM process. The in-situ LSP treatment includes selectively bringing an LSP module in contact with a surface of the part during the SLS/SLM process, and subjecting the LSP module to the action of a first laser beam to impart beneficial residual stresses into the part. The LSP module is movable between a building chamber where the part is being produced for the purpose of carrying out the in-situ LSP treatment, and a separate storage chamber when the LSP module is not used for the purpose of carrying out the in-situ LSP treatment. The invention is also implementable in a corresponding additive manufacturing system and method.


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