The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Jun. 24, 2020
Applicant:
Topcon Corporation, Tokyo, JP;
Inventors:
Bin Cao, Wayne, NJ (US);
Zhenguo Wang, Ridgewood, NJ (US);
Kinpui Chan, Ridgewood, NJ (US);
Zaixing Mao, Tokyo, JP;
Jongsik Kim, Fort Lee, NJ (US);
Assignee:
TOPCON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 3/10 (2006.01); A61B 3/00 (2006.01); G06T 7/00 (2017.01); G06T 7/62 (2017.01);
U.S. Cl.
CPC ...
A61B 3/101 (2013.01); A61B 3/0025 (2013.01); A61B 3/102 (2013.01); G06T 7/0012 (2013.01); G06T 7/62 (2017.01); G06T 2207/20056 (2013.01); G06T 2207/30041 (2013.01);
Abstract
A method for thickness measurement of a multi-layer object combines frequency analysis and a theoretical model. The frequency analysis is used to determine the thickness of a thicker layer of the object. The theoretical model is used to determine the thickness of the thinner layer of the object.