The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Nov. 01, 2017
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Satoru Wakiyama, Kanagawa, JP;
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Abstract
The present disclosure relates to a solid-state image sensor, a manufacturing method, and an electronic device that enable control of a wafer process and a chip size package (CSP) process even with no cover glass. A CIS wafer and a logic wafer including a logic circuit or a memory circuit are stacked and bonded. The CIS wafer and the logic wafer are electrically connected via a through electrode. After formation of a lens on a light receiving surface of the CIS wafer, a wafer support system material is bonded on the lens. An external electrode is formed as an external output, using a TSV formed from a back surface side of the logic wafer that has been made into a thin film. The wafer support system material is then separated from the light receiving surface. The present disclosure can be applied to, for example, a stacked-type back-illuminated solid-state image sensor.