The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Jul. 27, 2023
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Yoshito Sasaki, Tokyo, JP;
Tamaki Kobayashi, Kanagawa, JP;
Masato Ofuji, Gunma, JP;
Tomoyuki Oike, Kanagawa, JP;
Masao Ina, Kanagawa, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); G01T 1/202 (2006.01); H10F 39/18 (2025.01);
U.S. Cl.
CPC ...
H10F 39/011 (2025.01); G01T 1/2023 (2013.01); H10F 39/1898 (2025.01); H10F 39/804 (2025.01);
Abstract
A manufacturing method of a radiation imaging apparatus in which a sensor substrate and a scintillator are bonded by a bonding member, is provided. The method includes: forming, on a support substrate, a functional layer including a moisture preventing layer configured to suppress permeation of water; forming the scintillator on the support substrate with the functional layer arranged thereon; and separating, from the support substrate, at least a part of the scintillator together with the functional layer.