The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Aug. 08, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Hyoungtak Cho, Suwon-si, KR;
Bohyeon Kim, Suwon-si, KR;
Hyunggwang Kang, Suwon-si, KR;
Hojin Jung, Suwon-si, KR;
Hyunju Hong, Suwon-si, KR;
Yangwook Kim, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
According to an embodiment of the disclosure, an electronic device may include: a first housing, a second housing, a first support, a second support, a flexible display, a motor assembly including a motor, and a first thermal conductive member including a thermally conductive material. The second housing may be slidable relative to the first housing. The first support may be positioned in the first housing. The second support may be positioned in the second housing. The flexible display may include a first area and a second area configured to extend from the first area. The first area may be disposed on the first support and be configured to be visible to the outside of the electronic device. The second area may be configured to, during sliding of the second housing, be withdrawn from or inserted into an inner space of the electronic device while being supported by the second support. The motor assembly may be connected to the second support through a bracket disposed on the second support and be configured to provide a drive force for sliding of the second housing. The first thermal conductive member may be disposed on the first support. Based on the second area being inserted in the inner space of the electronic device, the bracket may be configured to be in contact with the first thermal conductive member.