The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Sep. 02, 2021
Applicant:

Omron Corporation, Kyoto, JP;

Inventors:

Junya Mishima, Kyoto, JP;

Tomoyuki Hakata, Kyoto, JP;

Assignee:

OMRON CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01);
Abstract

A heat-dissipating structure includes a board configured to be attached to a heating element, a resin layer provided between the board and a heat dissipation member, the resin layer being attached to the board, and at least one heat transfer portion configured to transfer heat generated by the heating element to the heat dissipation member through the resin layer. The at least one heat transfer portion includes a heat transfer member, which is plate-shaped, provided between the board and the resin layer, the heat transfer member extending along the board, and a conductive layer provided between the board and the resin layer and across the board and the heat transfer member, the conductive layer being partially disposed between the heat transfer member and the resin layer.


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