The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Aug. 31, 2022
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); H05K 1/115 (2013.01);
Abstract
A printed circuit board includes: a first insulating layer; a circuit pattern protruding from an upper surface of the first insulating layer and having recesses in side surfaces thereof; and a metal portion covering an upper surface and each of both side surfaces of the circuit pattern. The first insulating layer is spaced apart from at least a portion of a lower surface of the circuit pattern.
Cho, Mo. (2025). Printed circuit board and method for manufacturing the same (U.S. Patent No. 12446163). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12446163
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile