The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

May. 19, 2023
Applicant:

Arista Networks, Inc., Santa Clara, CA (US);

Inventors:

Eric Jau Heng Tse, Mountain View, CA (US);

Arshdeep Kaur, Santa Clara, CA (US);

Andrew D Boyko, Sunnyvale, CA (US);

Xin Xue, San Jose, CA (US);

Richard Neville Hibbs, Carmel-by-the-Sea, CA (US);

Assignee:

Arista Networks, Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); G06F 13/38 (2006.01); G06F 13/42 (2006.01); H05K 1/18 (2006.01); H01R 12/79 (2011.01);
U.S. Cl.
CPC ...
H05K 1/142 (2013.01); G06F 13/382 (2013.01); G06F 13/4282 (2013.01); H05K 1/183 (2013.01); G06F 2213/0042 (2013.01); H01R 12/79 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A network device that includes a temperature sensor module is provided. The network device can include a host printed circuit board, one or more processors mounted on a surface of the host printed circuit board, a port protruding from the surface of the host printed circuit board, and a temperature sensor module that is raised over the surface of the host printed circuit board to provide thermal decoupling from the surface of the host printed circuit board. The temperature sensor module can include a sensor printed circuit board, a temperature sensor integrated circuit die disposed on a first side of the sensor printed circuit board, and an exposed conductive pad disposed on a second side of the sensor printed circuit board. The temperature sensor module can include multiple exposed contacts or a plug configured to mate with the protruding port.


Find Patent Forward Citations

Tse, Eric Jau Heng. (2025). Network device with elevated temperature sensor (U.S. Patent No. 12446156). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12446156

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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