The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Dec. 02, 2022
Applicant:

Huawei Digital Power Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Faming Sun, Dongguan, CN;

Quanming Li, Dongguan, CN;

Jun Chen, Dongguan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02S 40/42 (2014.01); H02S 40/32 (2014.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H02S 40/425 (2014.12); H05K 7/20163 (2013.01); H05K 7/20918 (2013.01); H02S 40/32 (2014.12);
Abstract

A heat dissipation apparatus and a photovoltaic inverter are related to the field of heat dissipation device technologies, to improve a heat dissipation capability of the heat dissipation apparatus. The heat dissipation apparatus includes at least two stacked fan layers, and each fan layer includes at least one fan. A heat dissipation channel in a radiator has a first inlet, and the first inlet communicates with each air exhaust vent in at least one fan layer by using an air duct component. Compared with a solution in which fans are arranged along a width direction of the radiator, the at least two fan layers are stacked, which may not be limited by a width of the radiator. More fans can be arranged in a hierarchical stacking manner, and more fans can increase an overall amount of exhausted air, thereby improving the heat dissipation capability of the heat dissipation apparatus.


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