The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Apr. 18, 2022
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventor:

Yung-Hsiang Lin, Hsinchu, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/20 (2006.01); H01S 5/22 (2006.01); H01S 5/32 (2006.01); H01S 5/343 (2006.01);
U.S. Cl.
CPC ...
H01S 5/2054 (2013.01); H01S 5/22 (2013.01); H01S 5/3215 (2013.01); H01S 5/3218 (2013.01); H01S 5/343 (2013.01); H01S 2301/173 (2013.01);
Abstract

A light-emitting device is provided. An active layer is disposed on a substrate and between the first semiconductor layer and the second semiconductor layer. The first aluminum-containing semiconductor layer is disposed between the substrate and the first semiconductor layer, and a first aluminum composition ratio of the first aluminum-containing semiconductor layer is greater than that of the first semiconductor layer. The second aluminum-containing semiconductor layer is disposed between the first aluminum-containing semiconductor layer and the first semiconductor layer, and a second aluminum composition ratio of the second aluminum-containing semiconductor layer is greater than that of the first semiconductor layer. The stack structure is disposed between the first and second aluminum-containing semiconductor layers, and the stack structure includes first, second, and third indium-containing semiconductor layers stacked in sequence. The first, second, and third indium-containing semiconductor layers are made of InAlGaN (0<a1+b1<1), InAlGaN (0<a2+b2<1, and InAlGaN (0<a3+b3<1), respectively, and 0<a3≤a1<a2.


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