The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Jun. 28, 2022
Applicants:

Chong Zhang, Santa Barbara, CA (US);

Minh Tran, Goleta, CA (US);

Tin Komljenovic, Goleta, CA (US);

Inventors:

Chong Zhang, Santa Barbara, CA (US);

Minh Tran, Goleta, CA (US);

Tin Komljenovic, Goleta, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/02 (2006.01); H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/10 (2021.01);
U.S. Cl.
CPC ...
H01S 5/1014 (2013.01); H01S 5/0213 (2013.01); H01S 5/02476 (2013.01); H01S 5/026 (2013.01);
Abstract

A device includes a first element having a passive waveguide structure supporting a first optical mode, a second element providing heat spreading functionality, a third element thermally coupled to the second element, having an active waveguide structure supporting a second optical mode, and a fourth element, at least partly butt-coupled to the third element, having an intermediate waveguide structure supporting intermediate optical modes. A tapered waveguide structure in either one of the first and fourth elements facilitates efficient adiabatic transformation between the first optical mode and one of the intermediate optical modes. No adiabatic transformation occurs between any of the intermediate optical modes and the second optical mode. Mutual alignments of the first, second, third and fourth elements are defined using lithographic alignment marks that facilitate precise alignment between layers formed during processing steps of fabricating the first, second, third and fourth elements.


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