The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

May. 01, 2023
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventor:

Markus Josef Lang, Pfarrkirchen, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/12 (2006.01); G01S 7/03 (2006.01); G01S 7/35 (2006.01); H01P 11/00 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/121 (2013.01); G01S 7/032 (2013.01); G01S 7/35 (2013.01); H01P 11/002 (2013.01); H05K 1/181 (2013.01); H05K 3/0026 (2013.01); H05K 3/0044 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A method for producing a waveguide in a multilayer substrate involves producing at least one cutout corresponding to a lateral course of the waveguide in a surface of a first layer arrangement comprising one or a plurality of layers. A metallization is produced on surfaces of the cutout. A second layer arrangement comprising one or a plurality of layers is applied on the first layer arrangement. The second layer arrangement comprises, on a surface thereof, a metallization which, after the second layer arrangement has been applied on the first layer arrangement, is arranged above the cutout and together with the metallization on the surfaces of the cutout forms the waveguide.


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