The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Apr. 27, 2022
SK Hynix Inc., Icheon-si, KR;
Jong Joo Lee, Icheon-si, KR;
Kyeong Min Kim, Icheon-si, KR;
SK hynix Inc., Icheon-si, KR;
Abstract
A semiconductor package may include: a substrate having a first side and a second side on a same plane; a first semiconductor chip disposed over the second side of the substrate; a first one-side third semiconductor chip stack disposed over the first side of the substrate and spaced apart from the first semiconductor chip; a second semiconductor chip stack disposed over the first semiconductor chip and the first one-side third semiconductor chip stack, the second semiconductor chip stack including one or more second semiconductor chips; and a second one-side third semiconductor chip stack disposed over the second semiconductor chip stack, wherein each of the third semiconductor chip stacks includes a plurality of third semiconductor chips that are offset-stacked, offset towards the first side as the third semiconductor chips are farther from the substrate, each of the third semiconductor chip stacks being electrically connected to the substrate.