The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

May. 18, 2022
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Rajen Manicon Murugan, Dallas, TX (US);

Yiqi Tang, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/28 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/49805 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 24/08 (2013.01); H01L 24/09 (2013.01); H01L 24/16 (2013.01); H01L 2223/6633 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6688 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/0913 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/182 (2013.01);
Abstract

An electronic device includes a multilevel package substrate with first, second, third, and fourth levels, a semiconductor die mounted to the first level, and a conductor backed coplanar waveguide transmission line feed with an interconnect and a conductor, the interconnect including coplanar first, second, and third conductive lines extending in the first level along a first direction from respective ends to an antenna, the second and third conductive lines spaced apart from opposite sides of the first conductive line along an orthogonal second direction, and the conductor extending in the third level under the interconnect and under the antenna.


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