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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12444692 B1

PDFFull Text
Date of Patent:
Oct. 14, 2025

Filed:

Aug. 10, 2023

Power module comprising a semiconductor module component and an alignment part, and method for forming the power module

Applicant:

Hitachi Energy Ltd, Zürich, CH;

Inventors:

Dominik Truessel, Bremgarten, CH;

Milad Maleki, Untersiggenthal, CH;

Fabian Fischer, Baden, CH;

Lluis Santolaria, Olten, CH;

Assignee:

Hitachi Energy Ltd, Zürich, CH;

Attorney:

Procopio, Cory, Hargreaves & Savitch LLP

Primary Examiner:

Britt D Hanley

Assistant Examiner:

Victor V Barzykin

Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/50 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 25/07 (2006.01); H01L 25/10 (2006.01); H01R 12/58 (2011.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/50 (2013.01); H01L 23/053 (2013.01); H01L 23/3107 (2013.01); H01L 23/552 (2013.01); H01L 25/072 (2013.01); H01L 25/105 (2013.01); H01R 12/585 (2013.01); H05K 7/1432 (2013.01); H01L 2223/54426 (2013.01); H05K 7/142 (2013.01); H05K 2201/2036 (2013.01); H05K 2203/167 (2013.01);
Abstract

A power module having an alignment part fixed on a lateral top surface (10T) of a semiconductor module component. The semiconductor module component has at least one terminal which—at least in places—is orientated vertically with respect to the lateral top surface of the semiconductor module component and for the purpose of alignment along lateral directions, is located at least partly within the at least one recessed portion. Along a vertical direction, the at least one terminalprotrudes beyond the at least one recessed portion. The at least one recessed portion is located on a side surface of the alignment part, wherein the at least one recessed portion is a vertical slot being an open recess on the side surface of the alignment part, and wherein the slot is not a through-hole being completely surrounded by inner walls of the at least one recessed portion in lateral directions.

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Truessel, Dominik. (2025). Power module comprising a semiconductor module component and an alignment part, and method for forming the power module (U.S. Patent No. 12444692). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12444692

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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