The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Sep. 27, 2022
Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventors:

Bernd Kürten, Obermichelbach, DE;

Daniel Kappauf, Gräfenberg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/54 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/10 (2006.01); H01L 23/24 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01); H10D 12/00 (2025.01); H10D 30/60 (2025.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/4853 (2013.01); H01L 21/54 (2013.01); H01L 23/053 (2013.01); H01L 23/24 (2013.01); H01L 24/85 (2013.01); H01L 2224/858 (2013.01); H10D 12/411 (2025.01); H10D 30/60 (2025.01); H10D 62/8325 (2025.01);
Abstract

A housing part for accommodating a semiconductor element includes a pin partially molded in the housing part for electrical connection to a printed circuit board. The pin includes a bonding surface for producing an electrical connection between the pin and the semiconductor element. The housing part includes a bearing surface for the bonding surface and a recess formed in the bearing surface or adjoining the bearing surface. A vibration-damping material is at least partially filled in the recess and/or applied in a region adjoining the recess. The housing part is designed as a one-piece housing frame part.


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