The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Mar. 28, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Zhiqiang Huang, Singapore, SG;

Li Ming Tan, Singapore, SG;

Joanna Kejun Loh, Singapore, SG;

Olivia Fatma Koentjoro, Waterford Residence, SG;

Roger Alan Lindley, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G05B 13/02 (2006.01); G05B 13/04 (2006.01); G05B 19/401 (2006.01); G06F 30/3308 (2020.01); G06F 30/337 (2020.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); G05B 13/0265 (2013.01); G05B 13/048 (2013.01); G05B 19/401 (2013.01); G06F 30/3308 (2020.01); G06F 30/337 (2020.01); H01L 21/67 (2013.01);
Abstract

The disclosure describes methods and systems for training and deploying a machine learning predictive model for use in a semiconductor manufacturing process. Specifically, the present disclosure provides for training machine learning predictive models for manufacturing components using design data, process parameters, gas flow configurations from a pixelated showerhead, temperature profile across an electrostatic chuck, and measured uniformity profiles of processed wafers. The present disclosure also provides for deploying the machine learning predictive model to effectuate real-time adjustments to a manufacturing process.


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