The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Dec. 28, 2021
Applicant:
SK Enpulse Co., Ltd., Pyeongtaek-si, KR;
Inventors:
Seung Chul Hong, Suwon-si, KR;
Deok Su Han, Suwon-si, KR;
Hwan Chul Kim, Suwon-si, KR;
Han Teo Park, Suwon-si, KR;
Hyeong Ju Lee, Suwon-si, KR;
Assignee:
SK enpulse Co., Ltd., Pyeongtaek-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 3/30 (2006.01); C09G 1/00 (2006.01); C09G 1/02 (2006.01); C09G 1/14 (2006.01); C11D 3/37 (2006.01); H01L 21/3105 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31053 (2013.01); C09G 1/02 (2013.01); H01L 21/76819 (2013.01);
Abstract
A semiconductor process polishing composition, and a polishing method of a substrate applied with a polishing composition are provided. The process provides a polishing composition improved in the polishing rate, selectivity and dispersibility, and provides a manufacturing method of a substrate that is polished by applying such a polishing composition for a semiconductor process.