The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Jan. 12, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Xuebin Li, Sunnyvale, CA (US);

Sathya Chary, San Francisco, CA (US);

Joe Margetis, Gilbert, AZ (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/18 (2006.01); C23C 16/02 (2006.01); C23C 16/38 (2006.01); C30B 29/10 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02579 (2013.01); C23C 16/0236 (2013.01); C23C 16/38 (2013.01); C30B 25/186 (2013.01); C30B 29/10 (2013.01); H01L 21/02532 (2013.01); H01L 21/0262 (2013.01); H01L 21/02636 (2013.01);
Abstract

Embodiments of the present invention generally relate to methods of epitaxially growing boron-containing structures. In an embodiment, a method of depositing a structure comprising boron and a Group IV element on a substrate is provided. The method includes heating the substrate at a temperature of about 300° C. or more within a chamber, the substrate having a dielectric material and a single crystal formed thereon. The method further includes flowing a first process gas and a second process gas into the chamber, wherein: the first process gas comprises at least one boron-containing gas comprising a haloborane; and the second process gas comprises at least one Group IV element-containing gas. The method further includes exposing the substrate to the first and second process gases to epitaxially and selectively deposit the structure comprising boron and the Group IV element on the single crystal.


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