The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Feb. 07, 2022
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yusuke Nagai, Tokyo, JP;

Hidekazu Sato, Tokyo, JP;

Kazuhiro Ebina, Tokyo, JP;

Kunihiko Kawasaki, Tokyo, JP;

Takahiro Sato, Tokyo, JP;

Kouichi Kakuda, Tokyo, JP;

Yuya Ishima, Tokyo, JP;

Shinichi Kondo, Tokyo, JP;

Shinichi Sato, Tokyo, JP;

Masaki Takahashi, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 5/06 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 5/06 (2013.01); H01F 27/292 (2013.01); H01F 2017/002 (2013.01);
Abstract

In a multilayer coil component, first and second conductor patterns respectively have parallel parts that overlap in a lamination direction and non-parallel parts that do not overlap. The parallel parts of the first and second conductor patterns of one set are interconnected by a first through hole. The non-parallel parts of the first and second conductor patterns of sets adjacent to each other in the lamination direction are interconnected by a second through hole.


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