The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Aug. 16, 2021
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Liang Chen, Beijing, CN;

Ke Wang, Beijing, CN;

Haoliang Zheng, Beijing, CN;

Minghua Xuan, Beijing, CN;

Dongni Liu, Beijing, CN;

Hao Chen, Beijing, CN;

Qi Qi, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/131 (2023.01); G09G 3/3233 (2016.01); G09G 3/3258 (2016.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H10D 86/01 (2025.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); G11C 19/28 (2006.01);
U.S. Cl.
CPC ...
G09G 3/3258 (2013.01); G09G 3/3233 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 25/167 (2013.01); H10D 86/0214 (2025.01); H10D 86/441 (2025.01); H10D 86/60 (2025.01); G09G 2300/0426 (2013.01); G09G 2300/0819 (2013.01); G09G 2300/0852 (2013.01); G09G 2310/0286 (2013.01); G09G 2310/08 (2013.01); G09G 2320/0233 (2013.01); G11C 19/287 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/0568 (2013.01); H01L 2224/06182 (2013.01);
Abstract

A display backplane is provided, including a base, wherein pixel circuits, bonding electrodes, and bonding connection wires are on the base; the bonding electrodes are coupled to the bonding connection wires in a one-to-one correspondence; the bonding electrodes and the bonding connection wires are on two opposite surfaces of the base; the pixel circuits and the bonding connection wires are on a same side of the base; one end of each bonding connection wire is coupled to the bonding electrode through the first via in the base; the other end of each of at least some bonding connection wires is coupled to the pixel circuit; and an orthographic projection of at least one of the bonding electrodes and the bonding connection wires on the base is not coincident with an orthographic projection of the pixel circuit on the base.


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