The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Sep. 01, 2024
Kambix Innovations Ii, Llc, Albuquerque, NM (US);
Kambiz Vafai, Mission Viejo, CA (US);
Chao Wang, Riverside, CA (US);
Kambix Innovations, LLC, Albuquerque, NM (US);
Abstract
In an embodiment, a method for fast prediction of hotspot temperatures in three-dimensional (3D) integrated circuit (IC) chips, can involve inputting a dataset comprising thermal simulation data and associated parameters for 3D IC chips, wherein the dataset includes variables such as power distribution, processor core location distribution, and Through Silicon Via (TSV) distribution, applying a K-fold Cross Validation (K-CV) algorithm to train a machine learning model using the inputted dataset, wherein the K-CV algorithm is employed to optimize the training process and prevent overfitting, utilizing a Support Vector Regression (SVR) algorithm within the trained machine learning model to predict hotspot temperatures of the 3D IC chips, and adjusting a cooling strategy for cooling the 3D IC chips, in response to monitoring the hotspot temperatures via the trained machine learning model. The 3D IC chip can include a multi-layer structure including a group of vertically stacked semiconductor layers.