The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Oct. 25, 2021
Fuzhou Boe Optoelectronics Technology Co., Ltd., Fujian, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Zhang Hu, Beijing, CN;
Yubin Lin, Beijing, CN;
Chen Lin, Beijing, CN;
Qian Zhang, Beijing, CN;
Xi Chen, Beijing, CN;
Anshan Chen, Beijing, CN;
Tingwei Chen, Beijing, CN;
Min Feng, Beijing, CN;
Lijie Li, Beijing, CN;
Jia Liu, Beijing, CN;
Guowei Ma, Beijing, CN;
Minshang Quan, Beijing, CN;
Xuexin Yang, Beijing, CN;
Shoude Zhang, Beijing, CN;
Xuzhou Chen, Beijing, CN;
Zekai Chen, Beijing, CN;
Yangqing Wang, Beijing, CN;
Fuzhou BOE Optoelectronics Technology Co., Ltd., Fujian, CN;
Beijing BOE Technology Development Co., Ltd., Beijing, CN;
Abstract
The present disclosure provides a display panel and a display device, the display panel includes: an array substrate and an opposite substrate disposed oppositely, the array substrate having a ground terminal, the opposite substrate including a black matrix and a transparent conductive layer, the black matrix including a first part, a second part and an isolation trench which are sequentially disposed, and the isolation trench isolating the first part from the second part; a conductive adhesive connecting the ground terminal with the transparent conductive layer, a part of the conductive adhesive being between the array substrate and the opposite substrate, and orthographic projections of the part of the conductive adhesive and the first part on the array substrate being not overlapped; and a blocking structure in contact with the part of the conductive adhesive and configured for preventing the conductive adhesive from overflowing to the first part.