The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Dec. 01, 2023
Applicant:

Vayyar Imaging Ltd, Yehud, IL;

Inventors:

Raviv Melamed, Nes Ziona, IL;

Damian Hoffman, Tzur Yitzhak, IL;

Jonathan Rosenfeld, Ramat hasharon, IL;

Ronen Tur, Binyamina, IL;

Assignee:

VAYYAR IMAGING LTD, Yehud, IL;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01S 13/00 (2006.01); G01B 15/04 (2006.01); G01N 22/00 (2006.01); G01S 13/86 (2006.01); G01S 13/89 (2006.01); G06T 7/50 (2017.01); G06T 17/00 (2006.01); A61B 5/0507 (2021.01); A61B 8/00 (2006.01); G01S 13/90 (2006.01); H01Q 1/42 (2006.01); H01Q 5/48 (2015.01); H01Q 5/55 (2015.01); H01Q 9/04 (2006.01); H01Q 9/28 (2006.01); H01Q 13/10 (2006.01); H04B 7/0413 (2017.01);
U.S. Cl.
CPC ...
G01S 13/003 (2013.01); G01B 15/04 (2013.01); G01N 22/00 (2013.01); G01S 13/862 (2013.01); G01S 13/89 (2013.01); G06T 7/50 (2017.01); G06T 17/00 (2013.01); A61B 5/0507 (2013.01); A61B 8/4416 (2013.01); G01S 13/90 (2013.01); H01Q 1/422 (2013.01); H01Q 5/48 (2015.01); H01Q 5/55 (2015.01); H01Q 9/0407 (2013.01); H01Q 9/285 (2013.01); H01Q 13/10 (2013.01); H04B 7/0413 (2013.01);
Abstract

A system for generating a three dimension (3D) imaging of an object, the system comprising: an electromagnetic transducer array such as an RF (radio-frequency) antenna array surrounding the object said array comprising: a plurality of electromagnetic transducers; a transmitter unit for applying RF signals to said electromagnetic transducer array; and a receiver unit for receiving a plurality of RF signals affected by said object from said electromagnetic transducers array; a Radio Frequency Signals Measurement Unit (RFSMU) configured to receive and measure said plurality of plurality of affected RF signals and provide RF data of the object; and at least one processing unit, configured to process said RF data to identify the dielectric properties of said object and construct a 3D image of said object.


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