The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Jan. 18, 2022
Applicant:

Secop Gmbh, Flensburg, DE;

Inventors:

Olaf Puschmann, Wanderup, DE;

Sebastian Echelmeyer, Flensburg, DE;

Assignee:

SECOP GMBH, Flensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 7/00 (2006.01);
U.S. Cl.
CPC ...
F25B 7/00 (2013.01);
Abstract

The invention relates to a cooling unit for storing temperature-sensitive goods at a desired cooling temperature, comprising a cooling compartment () for storing the temperature-sensitive goods, an insulation () separating the cooling compartment () from an ambient space (), a multi-stage cascade refrigeration system adapted to cool down the cooling compartment () to the desired cooling temperature and/or maintain the desired cooling temperature in the cooling compartment (), said multi-stage cascade refrigeration system comprising at least a high-temperature refrigeration cycle () and a low-temperature refrigeration cycle (), whereas said low-temperature refrigeration cycle () comprises a low-temperature evaporator () arranged to absorb heat from the cooling compartment (), and whereas the high-temperature refrigeration cycle () comprises a high-temperature condenser () arranged to reject heat to the ambient space (), whereas a high-temperature evaporator () of the high-temperature refrigeration cycle () is thermally coupled to a low-temperature condenser () of the low-temperature refrigeration cycle () in order to form an intercooler, whereas said high-temperature evaporator () and/or said low-temperature condenser () are/is thermally coupled to the insulation ().


Find Patent Forward Citations

Loading…