The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Dec. 10, 2019
Applicant:

Eneos Corporation, Tokyo, JP;

Inventors:

Yoshinori Nishitani, Tokyo, JP;

Tatsuki Sato, Tokyo, JP;

Masaki Minami, Tokyo, JP;

Assignee:

ENEOS Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/62 (2006.01); C08J 5/24 (2006.01); C08K 3/36 (2006.01); C08K 5/357 (2006.01); C08L 63/00 (2006.01); C08L 79/04 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
C08G 59/621 (2013.01); C08K 3/36 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01);
Abstract

The invention provides a curable resin composition excellent in curability at low temperature for obtaining a cured product high in heat resistance, a cured product thereof, and methods of producing the curable resin composition and the cured product. Also provided is a semiconductor device using the cured product as a sealant. In particular, the invention provides a curable resin composition comprising (A) a benzoxazine compound represented by a structure of formula (1), (B) an epoxy compound, and (C) a phenol-based curing agent, wherein a number of epoxy groups in the epoxy compound (B), a number of benzoxazine rings in the benzoxazine compound (A), and a number of hydroxyl groups in the phenol-based curing agent (C) satisfy formula (2), and a ratio of the benzoxazine equivalent in the benzoxazine compound (A) to the hydroxyl group equivalent in the phenol-based curing agent (C) is 1.1 to 8.0.


Find Patent Forward Citations

Loading…