The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Oct. 04, 2022
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Daisuke Kori, Joetsu, JP;

Naoki Kobayashi, Shiojiri, JP;

Yasuyuki Yamamoto, Joetsu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C07D 403/02 (2006.01); C07D 209/40 (2006.01); C07D 403/06 (2006.01); C07D 403/10 (2006.01); G03F 7/039 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
C07D 403/02 (2013.01); C07D 209/40 (2013.01); C07D 403/06 (2013.01); C07D 403/10 (2013.01); G03F 7/039 (2013.01); H01L 21/0274 (2013.01);
Abstract

A material for forming an organic film, containing: a compound shown by formula (1); and an organic solvent. In formula (1), Rrepresents one of the following formulae (2), Rrepresents a nitro group, a halogen atom, a hydroxy group, an alkyloxy group, an alkynyloxy group, an alkenyloxy group, a linear, branched, or cyclic alkyl group, a trifluoromethyl group, or a trifluoromethyloxy group, 'n' represents 0 or 1, “m” represents an integer of 1 to 3, “p” represents 0 or 1, “l” represents an integer of 0 to 2, and W represents a divalent organic group having 2 to 40 carbon atoms. The objective: a compound which allows the formation of an organic underlayer film having excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, favorable film-formability and adhesiveness to a substrate; and a material for forming an organic film containing the compound.


Find Patent Forward Citations

Loading…