The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Feb. 20, 2021
Applicants:

Beijing Boe Technology Development Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventor:

Zhuo Chen, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C07C 59/84 (2006.01); B82Y 40/00 (2011.01); C07C 321/30 (2006.01); C07C 323/19 (2006.01); C07C 323/22 (2006.01); C07D 303/34 (2006.01); C09K 11/02 (2006.01); G03F 7/004 (2006.01); H10K 50/115 (2023.01); H10K 71/00 (2023.01); H10K 71/20 (2023.01); H10K 71/40 (2023.01);
U.S. Cl.
CPC ...
C07D 303/34 (2013.01); B82Y 40/00 (2013.01); C07C 59/84 (2013.01); C07C 321/30 (2013.01); C07C 323/19 (2013.01); C07C 323/22 (2013.01); C09K 11/02 (2013.01); G03F 7/004 (2013.01); H10K 71/00 (2023.02); H10K 71/40 (2023.02);
Abstract

The present disclosure relates to a crosslinking ligand, a method for patterning a nanoparticle layer, a quantum dot light-emitting device, and a display device. The crosslinking ligand includes: at least two coordinating groups, at least one photosensitive degradation group and at least one thermosensitive crosslinking group, both of which are connected between the coordinating groups. The method for patterning the nanoparticle layer includes: forming a nanoparticle layer on a substrate; attaching a solution containing the crosslinking ligand to the substrate, to allow the crosslinking ligand to form a crosslinking between nanoparticles; performing a light irradiation treatment on a preset region of the substrate; removing the nanoparticles in the preset region; and performing a heat treatment on the substrate. The present disclosure does not need to design the structure of the ligand of the nanoparticles, and can form a nanoparticle layer with high resolution, simple process and high realizability.


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