The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Nov. 10, 2021
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Jae Sung Park, Suwon-si, KR;
Hee Sun Chun, Suwon-si, KR;
In Tae Seo, Suwon-si, KR;
Hyung Joon Jeon, Suwon-si, KR;
Chung Eun Lee, Suwon-si, KR;
Jong Han Kim, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 17/06 (2006.01); C04B 35/468 (2006.01); H01C 1/148 (2006.01); H01C 7/00 (2006.01); H01C 7/10 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01); H10N 30/87 (2023.01);
U.S. Cl.
CPC ...
C04B 35/4682 (2013.01); H01C 1/148 (2013.01); H01C 7/008 (2013.01); H01C 7/10 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01G 4/1227 (2013.01); H01G 4/232 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); H10N 30/87 (2023.02); C04B 2235/401 (2013.01); C04B 2235/428 (2013.01); C04B 2235/781 (2013.01); C04B 2235/785 (2013.01); C04B 2235/85 (2013.01); H01F 2027/2809 (2013.01);
Abstract
A dielectric material includes a main component represented by (BaCa)(Ti(Zr, Sn, Hf))O(0≤x≤1 and 0≤y≤0.5); a first subcomponent including at least one of elements among Y, Dy, Ho, Er, Gd, Ce, Nd, Nb, Sm, Tb, Eu, Tm, La, Lu, and Yb; a second subcomponent including Si and/or Al; and a third subcomponent including Ba and/or Ca.