The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Sep. 21, 2020
Applicants:

Top Technology Ltd, Pyeongtaek-si, KR;

Sherkin Technologies Limited, Dublin, IE;

Inventors:

Youngho Lee, Yongin-si, KR;

Yongtae Kim, Yongin-si, KR;

Sangbae Kim, Hwaseong-si, KR;

Donal O'Sullivan, Dublin, IE;

Assignees:

TOP TECHNOLOGY LTD, Pyeongtaek-si, KR;

SHERKIN TECHNOLOGIES LIMITED, Dublin, IE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B01L 3/00 (2006.01); B81C 3/00 (2006.01); B81C 99/00 (2010.01); H01J 37/32 (2006.01); B29K 683/00 (2006.01);
U.S. Cl.
CPC ...
B81C 99/0025 (2013.01); B01L 3/502707 (2013.01); B29C 66/00145 (2013.01); B29C 66/028 (2013.01); B29C 66/95 (2013.01); B81C 3/001 (2013.01); H01J 37/32183 (2013.01); H01J 37/32568 (2013.01); H01J 37/32715 (2013.01); B01L 2200/12 (2013.01); B01L 2300/123 (2013.01); B29K 2683/00 (2013.01); B81C 2203/037 (2013.01); B81C 2203/051 (2013.01); H01J 37/32825 (2013.01); H01J 2237/20214 (2013.01); H01J 2237/20235 (2013.01); H01J 2237/20292 (2013.01);
Abstract

The present invention relates to a process and apparatus for the preparation of a bonded substrate. More particularly, the present invention relates to a PDMS bonding apparatus. More specifically, the present invention relates to a PDMS bonding apparatus which uses plasma to bond PDMS to a substrate. The present invention discloses a PDMS bonding apparatus and process for using said apparatus, the apparatus comprising: a process chamber () forming a sealed processing space (S) for bonding of PDMS (polydimethylsiloxane); a first support () installed in the process chamber () and which supports the PDMS (); a second support () installed in the process chamber () opposing the first support () and which supports a bonding object () which is bonded to the PDMS (); a gas injection unit () which ejects process gas between the first support () and the second support (), and; a plasma generator () which creates a plasma atmosphere within the process chamber ().


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