The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Jan. 23, 2023
Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventor:

Kenta Hiwatashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/16 (2006.01); B29C 65/00 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/34 (2006.01); C08K 3/016 (2018.01); C08K 7/14 (2006.01); C08L 77/00 (2006.01); B29K 77/00 (2006.01); B29K 105/16 (2006.01);
U.S. Cl.
CPC ...
B29C 65/1638 (2013.01); B29C 66/71 (2013.01); B29C 66/73365 (2013.01); B29C 66/7392 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/34 (2013.01); C08K 3/016 (2018.01); C08K 7/14 (2013.01); C08L 77/00 (2013.01); B29K 2077/00 (2013.01); B29K 2105/16 (2013.01); B29K 2995/0016 (2013.01); B29K 2995/0026 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/412 (2013.01); C08L 2205/025 (2013.01);
Abstract

A formed article obtained by performing laser welding on a transmitting resin member and an absorbing resin member, includes: a bonded part where the transmitting resin member and the absorbing resin member are bonded to each other by the laser welding, in which a molten pool is observed at the bonded part in a cross section that includes a normal to the transmitting resin member or the absorbing resin member and is orthogonal to a scanning direction of a laser beam, an area of the molten pool is 0.210 mmor more and 1.00 mmor less, the transmitting resin member and the absorbing resin member are each molded from a resin composition, the resin composition contains a thermoplastic resin, the thermoplastic resin contains at least a polyamide-based resin (A1), and a glass transition point temperature of the resin composition is 85° C. or higher.


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