The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Mar. 17, 2022
Applicant:

Florida A&m University, Tallahassee, FL (US);

Inventors:

Tarik J. Dickens, Tallahassee, FL (US);

Sean Psulkowski, Fernandina Beach, FL (US);

Charissa Lucien, Tallahassee, FL (US);

Mingchia Dawn Yang, Tallahassee, FL (US);

Assignee:

Florida A&M University, Tallahassee, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/118 (2017.01); B29C 64/209 (2017.01); B29C 64/245 (2017.01); B29C 64/314 (2017.01); B29C 64/321 (2017.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/10 (2020.01); B33Y 50/02 (2015.01); B33Y 70/00 (2020.01); B29K 67/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B29C 64/209 (2017.08); B29C 64/245 (2017.08); B29C 64/314 (2017.08); B29C 64/321 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/10 (2020.01); B33Y 50/02 (2014.12); B33Y 70/00 (2014.12); B29K 2067/046 (2013.01);
Abstract

A device and related methods for determining adhesion dynamics of the rapid deposition of a filament is disclosed herein. The device includes a stage having a top surface. An aperture residing within the top surface of the stage is disposed within a first plane. A thermally transparent film is stretched across the aperture and secured under tension. The thermally transparent film resides within a second plane that is parallel to the first plane and is configured to facilitate the transmission of infrared waves through the transparent film. A thermal camera is disposed in underlying relation to the thermally transparent film and is configured to collect a thermal signature of the filament being extruded by a nozzle. A digital microscope is disposed in an orthogonal relationship with the print path. The digital microscope is configured to capture video data during the extrusion of the filament being deposited on the stage.


Find Patent Forward Citations

Loading…