The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Nov. 17, 2022
Applicant:
Hyosung Heavy Industries Corporation, Seoul, KR;
Inventors:
Jung Woo Park, Changwon-si, KR;
Dong Woen Lee, Changwon-si, KR;
Young Soo Chung, Changwon-si, KR;
Hyeon Gweon Cheon, Gimhae-si, KR;
Assignee:
HYOSUNG HEAVY INDUSTRIES CORPORATION, Seoul, KR;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/34 (2006.01); B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
B29C 45/34 (2013.01); B29C 45/14065 (2013.01);
Abstract
The present disclosure is a high-speed molding device. According to the present invention, a productmay be manufactured by filling resin in a cavityformed by a first moldand a second mold. A gas generated during the filling of the cavitywith the resin may be discharged through a vent unit. The vent unithas a first flow pathand a second flow pathto discharge the gas, while the resin is allowed to flow up to only the first flow path