The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Dec. 20, 2019
Tanazawa Hakkosha Co., Ltd., Higashiosaka, JP;
Eschmann Textures International Gmbh, Gummersbach, DE;
Mitsushi Sogabe, Higashiosaka, JP;
Melanie Eurich, Heilbronn, DE;
Frederik Eurich, Bad Friedrichshal, DE;
TANAZAWA HAKKOSHA CO., LTD., Higashiosaka, JP;
ESCHMANN TEXTURES INTERNATIONAL GMBH, Gummersbach, DE;
Abstract
To provide a resin molded product having a desired surface shape, a resin molding mold which can manufacture the resin molded product and a method of manufacturing the same, and a resin molding mold manufacturing system to achieve manufacturing of the resin molding mold, a resin molding mold according to the present invention includes a molding mold main body and a resin layer exposedly formed on a mold surface side of the molding mold main body, made of a heat-resistant complex material containing a synthetic resin, and a ceramic powder particle, and having a thickness of 50 to 800 μm. The resin molding mold according to the present invention includes the molding mold main body and the resin layer exposedly formed on the mold surface side of the molding mold main body and made of the heat-resistant composite materials including a synthetic resin, and the ceramic powder particle, and recesses and projections are formed on the resin layer by excavating a portion of the resin layer.