The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Aug. 10, 2021
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Shigenobu Asada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23Q 17/24 (2006.01); B29C 64/379 (2017.01); B29C 64/393 (2017.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B33Y 40/20 (2020.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B23Q 17/2471 (2013.01); B29C 64/379 (2017.08); B29C 64/393 (2017.08); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 40/20 (2020.01); B33Y 50/02 (2014.12);
Abstract

A measurement device includes: a sensor that acquires image information by imaging an object targeted for addition of materials or cutting; a measurement unit that acquires measurement data by measuring the shape of the object on the basis of the image information, the measurement data representing a shape of the object; a missing region detecting unit that detects a missing region of the object; a measurement data complementing unit that acquires re-measurement data by re-measuring the shape of the object on the basis of the image information which the sensor has acquired by re-imaging, and complements the measurement data with the re-measurement data; and a machining region specifying unit that specifies a machining region for the addition or the cutting, on the basis of the complemented measurement data and a model of a finished product obtained by the addition or the cutting.


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